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Cita APA (7a ed.)
Huang, C., Shiotsuki, M., & Masuda, T. (2026). Perspective Chapter: A Synergistic Strategy for Sub-10 nm IC Manufacturing – From Post-CMP Cleaning with Biomimetic PVA Smart Brushes to Post-EUV Encapsulation with Advanced Polyimide. IntechOpen. https://doi.org/10.5772/intechopen.1013084
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Cita Chicago Style (17a ed.)
Huang, Ching-Cheng, Masashi Shiotsuki, y Toshio Masuda. Perspective Chapter: A Synergistic Strategy for Sub-10 Nm IC Manufacturing – From Post-CMP Cleaning with Biomimetic PVA Smart Brushes to Post-EUV Encapsulation with Advanced Polyimide. IntechOpen, 2026. https://doi.org/10.5772/intechopen.1013084.
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Cita MLA (9a ed.)
Huang, Ching-Cheng, et al. Perspective Chapter: A Synergistic Strategy for Sub-10 Nm IC Manufacturing – From Post-CMP Cleaning with Biomimetic PVA Smart Brushes to Post-EUV Encapsulation with Advanced Polyimide. IntechOpen, 2026. https://doi.org/10.5772/intechopen.1013084.
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