Registro de Citas
Cita APA (7a ed.)
Huang, C., Li, M., Huang, S., Chang, C., & Huang, M. (2011). Material Characterization and Failure Analysis for Microelectronics Assembly Processes. IntechOpen. https://doi.org/10.5772/23532
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Cita Chicago Style (17a ed.)
Huang, Chien-Yi, Ming-Shu Li, Shan-Yu Huang, Cheng-I Chang, y Min-Hui Huang. Material Characterization and Failure Analysis for Microelectronics Assembly Processes. IntechOpen, 2011. https://doi.org/10.5772/23532.
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Cita MLA (9a ed.)
Huang, Chien-Yi, et al. Material Characterization and Failure Analysis for Microelectronics Assembly Processes. IntechOpen, 2011. https://doi.org/10.5772/23532.
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