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Cita APA (7a ed.)
Raynal, F. (2012). Integration of Electrografted Layers for the Metallization of Deep Through Silicon Vias. IntechOpen. https://doi.org/10.5772/33948
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Cita Chicago Style (17a ed.)
Raynal, Frederic. Integration of Electrografted Layers for the Metallization of Deep Through Silicon Vias. IntechOpen, 2012. https://doi.org/10.5772/33948.
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Cita MLA (9a ed.)
Raynal, Frederic. Integration of Electrografted Layers for the Metallization of Deep Through Silicon Vias. IntechOpen, 2012. https://doi.org/10.5772/33948.
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