ACF Curing Process Optimization for Chip-on-Glass (COG) Considering Mechanical and Electrical Properties of Joints
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Guardado en:
| Autores principales: | , , , |
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| Formato: | Capítulo de libro |
| Lenguaje: | inglés |
| Publicado: |
IntechOpen
2009
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| Materias: | |
| Acceso en línea: | https://www.intechopen.com/chapters/11266 |
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