Thermal Reliability Issues in ReRAM Memory Arrays
<p id="p1">A localized buildup of Joules heat occurs in a memory cell as a result of the switching of resistive memory (resistive random access memory, (ReRAM)) cells. In ReRAM memory crossbar architecture, heat accumulated in one cell transfers to nearby cells via shared electrode metal lines and i...
Guardado en:
| Autores principales: | , , |
|---|---|
| Formato: | Capítulo de libro |
| Lenguaje: | inglés |
| Publicado: |
IntechOpen
2023
|
| Materias: | |
| Acceso en línea: | https://www.intechopen.com/chapters/1153166 |
| Etiquetas: |
Sin Etiquetas, Sea el primero en etiquetar este registro!
|
Sea el primero en dejar un comentario!