Low-Temperature Sintering Technologies in Power Electronics: Materials, Process, and Advanced Packaging of SiC WBG Semiconductors

<p id="p1">SiC power devices represent a breakthrough in wide bandgap semiconductor technology, offering superior performance through high current density, extreme temperature operation, and fast switching capabilities that enable transformative improvements in power electronics, yet their full pote...

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Detalles Bibliográficos

Autores principales:	Yan, Haidong, Li, Wanli, Liao, Yaqin, Liu, Chaohui
Formato:	Capítulo de libro
Lenguaje:	inglés
Publicado:	IntechOpen 2025
Materias:	Physical Sciences, Engineering and Technology
Acceso en línea:	https://www.intechopen.com/chapters/1201654
Etiquetas:	Agregar Etiqueta Sin Etiquetas, Sea el primero en etiquetar este registro!