Plasma Nitriding of Al–Cu and Al–Cu–Mg Alloys at Various Holding Temperature

<p>A plasma nitriding has been highlighted as a surface treatment to harden aluminum alloys and improve their wear resistance. Various processing approaches were reviewed to describe the nitriding processes at relatively high temperatures. Duralumin and super-duralumin alloys, such as Al&ndash;Cu an...

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Autores principales: Aizawa, Tatsuhiko, Nakata, Hiroki, Nasu, Takeshi
Formato: Capítulo de libro
Lenguaje:inglés
Publicado: IntechOpen 2026
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Acceso en línea:https://www.intechopen.com/chapters/1228087
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Sumario:<p>A plasma nitriding has been highlighted as a surface treatment to harden aluminum alloys and improve their wear resistance. Various processing approaches were reviewed to describe the nitriding processes at relatively high temperatures. Duralumin and super-duralumin alloys, such as Al&ndash;Cu and Al&ndash;Cu&ndash;Mg alloys, were nitrided by DC- and RF-DC plasmas at holding temperatures ranging from 723&thinsp;K to 623&thinsp;K. An AlN (Aluminum Nitride)-rich layer formation characterized the nitriding behavior of Al&ndash;Cu alloys at 673&thinsp;K. The intermetallic precipitate of Al<sub>2</sub>Cu facilitated this fast-rate AlN-layer formation as a catalyst. This process was affected at 723&thinsp;K by Mg diffusion and surface oxidation in the case of plasma nitriding of Al&ndash;Cu&ndash;Mg alloys. The plasma nitriding at 623&thinsp;K was free from this deterioration, allowing the AlN-rich layer to form in a manner similar to the nitriding of Al&ndash;Cu alloys. This layer exhibited a hardness greater than 1,000 HV, which is 10 times higher than the original hardness of Al&ndash;Cu&ndash;Mg alloys. A heatsink was plasma nitrided at 623&thinsp;K to demonstrate that aluminum alloy parts could be homogeneously nitrided to form the AlN-rich layer. The plasma nitriding at temperatures lower than 600&thinsp;K was investigated to explore the possibility of nitrogen supersaturation in aluminum alloys, as well as the accommodated nitriding process via intermetallic precipitates other than Al<sub>2</sub>Cu.</p>
ISBN:978-1-83635-707-0
DOI:10.5772/intechopen.1014134