Low Temperature Wafer-Level Metal Thermo-Compression Bonding Technology for 3D Integration
None
Saved in:
| Main Authors: | , |
|---|---|
| Format: | Book Chapter |
| Language: | English |
| Published: |
IntechOpen
2012
|
| Subjects: | |
| Online Access: | https://www.intechopen.com/chapters/39179 |
| Tags: |
No Tags, Be the first to tag this record!
|
Similar Items: Low Temperature Wafer-Level Metal Thermo-Compression Bonding Technology for 3D Integration
- Network Design for Wafer-Scale Systems with Wafer-on-Wafer Hybrid Bonding
- Low-Temperature Performance and Manufacture of Metals
- Particle Reduction at Metal Deposition Process in Wafer Fabrication
- Advanced Plasma Processing: Etching, Deposition, and Wafer Bonding Techniques for Semiconductor Applications
- Thermal Analysis of a 3D Stacked High-Performance Commercial Microprocessor using Face-to-Face Wafer Bonding Technology
- Mechanical Strength of Adhesively Bonded Metals