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Cita APA (7a ed.)
Niitsu, K., & Kuroda, T. (2010). An Inductive-Coupling Inter-Chip Link for High-Performance and Low-Power 3D System Integration. IntechOpen. https://doi.org/10.5772/6885
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Cita Chicago Style (17a ed.)
Niitsu, Kiichi, y Tadahiro Kuroda. An Inductive-Coupling Inter-Chip Link for High-Performance and Low-Power 3D System Integration. IntechOpen, 2010. https://doi.org/10.5772/6885.
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Cita MLA (9a ed.)
Niitsu, Kiichi, y Tadahiro Kuroda. An Inductive-Coupling Inter-Chip Link for High-Performance and Low-Power 3D System Integration. IntechOpen, 2010. https://doi.org/10.5772/6885.
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