Recent Advancements in Thermal Performance Enhancement in Microchannel Heatsinks for Electronic Cooling Application

Thermal management of electronic equipment is the primary concern in the electronic industry. Miniaturization and high power density of modern electronic components in the energy systems and electronic devices with high power density demanded compact heat exchangers with large heat dissipating capac...

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Detalles Bibliográficos

Autores principales:	Korasikha, Naga Ramesh, Sharma, Thopudurthi Karthikeya, Rao, Gadale Amba Prasad, Murthy, Kotha Madhu
Formato:	Capítulo de libro
Lenguaje:	inglés
Publicado:	IntechOpen 2021
Materias:	Physical Sciences, Engineering and Technology
Acceso en línea:	https://www.intechopen.com/chapters/76349
Etiquetas:	Agregar Etiqueta Sin Etiquetas, Sea el primero en etiquetar este registro!