Dynamic Finite Element Analysis on Underlay Microstructure of Cu/low-k Wafer during Wirebonding
The aim of present research is to investigate dynamic stress analysis for microstructure of Cu/Low-K wafer subjected to wirebonding predicted by finite element software ANSYS/LS-DYNA. Two major analyses are conducted in the present research. In the first, the characteristic of heat affected zone (HA...
Guardado en:
| Autores principales: | , , , , |
|---|---|
| Formato: | Capítulo de libro |
| Lenguaje: | inglés |
| Publicado: |
IntechOpen
2010
|
| Materias: | |
| Acceso en línea: | https://www.intechopen.com/chapters/12101 |
| Etiquetas: |
Sin Etiquetas, Sea el primero en etiquetar este registro!
|