Dynamic Finite Element Analysis on Underlay Microstructure of Cu/low-k Wafer during Wirebonding
The aim of present research is to investigate dynamic stress analysis for microstructure of Cu/Low-K wafer subjected to wirebonding predicted by finite element software ANSYS/LS-DYNA. Two major analyses are conducted in the present research. In the first, the characteristic of heat affected zone (HA...
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| Autores principales: | , , , , |
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| Formato: | Capítulo de libro |
| Lenguaje: | inglés |
| Publicado: |
IntechOpen
2010
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| Materias: | |
| Acceso en línea: | https://www.intechopen.com/chapters/12101 |
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