Application of Thermo-Viscoelastic Laminated Plate Theory to Predict Warpage of Printed Circuit Boards
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Guardado en:
| Autores principales: | , , |
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| Formato: | Capítulo de libro |
| Lenguaje: | inglés |
| Publicado: |
IntechOpen
2012
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| Materias: | |
| Acceso en línea: | https://www.intechopen.com/chapters/40737 |
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