Application of Thermo-Viscoelastic Laminated Plate Theory to Predict Warpage of Printed Circuit Boards
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| Main Authors: | , , |
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| Format: | Book Chapter |
| Language: | English |
| Published: |
IntechOpen
2012
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| Subjects: | |
| Online Access: | https://www.intechopen.com/chapters/40737 |
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| Summary: | None |
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| ISBN: | 978-953-51-0841-2 |
| DOI: | 10.5772/49978 |