Chemical Mechanical Planarization-Related to Contaminants: Their Sources and Characteristics
Chemical mechanical planarization (CMP) process has been widely used to planarize a variety of materials including dielectrics, metal, and semiconductors in Si-based semiconductor devices. It is one of the most critical steps to achieve the nanolevel wafer and die scale planarity. However, various c...
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| Formato: | Capítulo de libro |
| Lenguaje: | inglés |
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IntechOpen
2020
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| Materias: | |
| Acceso en línea: | https://www.intechopen.com/chapters/73793 |
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