Boiling Heat Transfer on the Micro-Textured Interfaces
Higher heat flux than its normal criticality from high-power transistors, LIDAR (Laser Imaging Detection and Ranging), stacked CPUs, high-power transistors, and lasers must be efficiently transferred to cooling media through the metallic interface. The micro-/nano-textured aluminum and copper device...
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| Autores principales: | , , |
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| Formato: | Capítulo de libro |
| Lenguaje: | inglés |
| Publicado: |
IntechOpen
2022
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| Materias: | |
| Acceso en línea: | https://www.intechopen.com/chapters/82747 |
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