Boiling Heat Transfer on the Micro-Textured Interfaces

Higher heat flux than its normal criticality from high-power transistors, LIDAR (Laser Imaging Detection and Ranging), stacked CPUs, high-power transistors, and lasers must be efficiently transferred to cooling media through the metallic interface. The micro-/nano-textured aluminum and copper device...

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Detalles Bibliográficos

Autores principales:	Aizawa, Tatsuhiko, Ono, Naoki, Nakata, Hiroki
Formato:	Capítulo de libro
Lenguaje:	inglés
Publicado:	IntechOpen 2022
Materias:	Physical Sciences, Engineering and Technology
Acceso en línea:	https://www.intechopen.com/chapters/82747
Etiquetas:	Agregar Etiqueta Sin Etiquetas, Sea el primero en etiquetar este registro!