High-Performance Reworkable Underfill Adhesives Based on Dicyclopentadiene Epoxy Thermoset
A highly reliable and reworkable underfill adhesive based on thermoset epoxy resin possessing thermally reversible dicyclopentadiene (DCPD) moiety is described. The adhesive can be cured rapidly at moderate temperatures resulting in high Tg cured network, which gives high reliability to the bonded s...
Guardado en:
| Autores principales: | , |
|---|---|
| Formato: | Capítulo de libro |
| Lenguaje: | inglés |
| Publicado: |
IntechOpen
2022
|
| Materias: | |
| Acceso en línea: | https://www.intechopen.com/chapters/84190 |
| Etiquetas: |
Sin Etiquetas, Sea el primero en etiquetar este registro!
|