High-Performance Reworkable Underfill Adhesives Based on Dicyclopentadiene Epoxy Thermoset

A highly reliable and reworkable underfill adhesive based on thermoset epoxy resin possessing thermally reversible dicyclopentadiene (DCPD) moiety is described. The adhesive can be cured rapidly at moderate temperatures resulting in high Tg cured network, which gives high reliability to the bonded s...

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Detalles Bibliográficos

Autores principales:	Sridhar, Laxmisha M., Champagne, Timothy M.
Formato:	Capítulo de libro
Lenguaje:	inglés
Publicado:	IntechOpen 2022
Materias:	Physical Sciences, Engineering and Technology
Acceso en línea:	https://www.intechopen.com/chapters/84190
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