Advanced Plasma Processing: Etching, Deposition, and Wafer Bonding Techniques for Semiconductor Applications

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Bibliographic Details
Main Authors: Shearn, Michael, Sun, Xiankai, Henry, M. David, Yariv, Amnon, Scherer, Axel
Format: Book Chapter
Language:English
Published: IntechOpen 2010
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Online Access:https://www.intechopen.com/chapters/9781
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