Perspective Chapter: A Synergistic Strategy for Sub-10 nm IC Manufacturing – From Post-CMP Cleaning with Biomimetic PVA Smart Brushes to Post-EUV Encapsulation with Advanced Polyimide
<p>This research introduces a novel synergistic strategy to fundamentally enhance the manufacturing yield and long-term reliability of sub-10 nm integrated circuits. Our approach deliberately bridges two distinct yet profoundly interconnected critical process nodes surrounding Extreme ultravi...
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| Autores principales: | , , |
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| Formato: | Capítulo de libro |
| Lenguaje: | inglés |
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IntechOpen
2026
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| Acceso en línea: | https://www.intechopen.com/chapters/1237146 |
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| _version_ | 1879164893222928384 |
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| author | Huang, Ching-Cheng Shiotsuki, Masashi Masuda, Toshio |
| author_browse | Huang, Ching-Cheng Masuda, Toshio Shiotsuki, Masashi |
| author_facet | Huang, Ching-Cheng Shiotsuki, Masashi Masuda, Toshio |
| author_sort | Huang, Ching-Cheng |
| building | IntechOpen |
| collection | Acceso abierto |
| description | <p>This research introduces a novel synergistic strategy to fundamentally enhance the manufacturing yield and long-term reliability of sub-10 nm integrated circuits. Our approach deliberately bridges two distinct yet profoundly interconnected critical process nodes surrounding Extreme ultraviolet (EUV) lithography. First, we introduce a novel soft polymeric brush for post-chemical mechanical planarization (Post-CMP) cleaning. These materials feature a bio-inspired three-dimensional microchannel network, drawing inspiration from the pneumatic drainage systems of avian skeletons. This architecture, with its multi-scale channels, is engineered to enhance fluid flow and prevent particle entrapment, a leading cause of wafer scratching. We performed a comprehensive characterizationto verify their structural stability, purity, and safet, which establishes a new foundation for developing advanced cleaning materials that improve efficiency and protect delicate semiconductor structures. Subsequently, we introduce a advanced polyimide for post-EUV encapsulation as the second component of this strategy. Its unique transparency allows for critical non-destructive optical inspection of the ultra-fine sub-10 nm circuitry post-encapsulation, a capability vital for ensuring quality control and reliability. Acknowledging the significant challenges of a full-process-flow replacement, our practical process evaluation has led to a pragmatic phased implementation approach. We will first strategically focus on the bio-inspired polyvinyl acetal (PVA) brush technology. Its superior fluid exchange rate not only effectively reduces contamination, lowers defects, and improves yield, but it also dramatically conserves water. These advantages not only prove the efficacy of this single technology but also establish a robust foundation for the future integration of our entire dual-core solution, highlighting the long-term value of our research.</p> |
| doi_str_mv | 10.5772/intechopen.1013084 |
| first_indexed | 2026-10-15T21:41:34Z |
| format | Book Chapter |
| fullrecord | <oai_dc:dc xmlns:oai_dc="http://www.openarchives.org/OAI/2.0/oai_dc/" xmlns:dc="http://purl.org/dc/elements/1.1/" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xsi:schemaLocation="http://www.openarchives.org/OAI/2.0/oai_dc/ http://www.openarchives.org/OAI/2.0/oai_dc.xsd"><identifier>intech-1237146</identifier><datestamp>2026-03-11</datestamp>
<dc:title>Perspective Chapter: A Synergistic Strategy for Sub-10 nm IC Manufacturing – From Post-CMP Cleaning with Biomimetic PVA Smart Brushes to Post-EUV Encapsulation with Advanced Polyimide</dc:title>
<dc:creator>Ching-Cheng Huang</dc:creator>
<dc:creator>Masashi Shiotsuki</dc:creator>
<dc:creator>Toshio Masuda</dc:creator>
<dc:subject>Physical Sciences, Engineering and Technology</dc:subject>
<dc:description><p>This research introduces a novel synergistic strategy to fundamentally enhance the manufacturing yield and long-term reliability of sub-10&thinsp;nm integrated circuits. Our approach deliberately bridges two distinct yet profoundly interconnected critical process nodes surrounding Extreme ultraviolet (EUV) lithography. First, we introduce a novel soft polymeric brush for post-chemical mechanical planarization (Post-CMP) cleaning. These materials feature a bio-inspired three-dimensional microchannel network, drawing inspiration from the pneumatic drainage systems of avian skeletons. This architecture, with its multi-scale channels, is engineered to enhance fluid flow and prevent particle entrapment, a leading cause of wafer scratching. We performed a comprehensive characterizationto verify their structural stability, purity, and safet, which establishes a new foundation for developing advanced cleaning materials that improve efficiency and protect delicate semiconductor structures. Subsequently, we introduce a advanced polyimide for post-EUV encapsulation as the second component of this strategy. Its unique transparency allows for critical non-destructive optical inspection of the ultra-fine sub-10&thinsp;nm circuitry post-encapsulation, a capability vital for ensuring quality control and reliability. Acknowledging the significant challenges of a full-process-flow replacement, our practical process evaluation has led to a pragmatic phased implementation approach. We will first strategically focus on the bio-inspired polyvinyl acetal (PVA) brush technology. Its superior fluid exchange rate not only effectively reduces contamination, lowers defects, and improves yield, but it also dramatically conserves water. These advantages not only prove the efficacy of this single technology but also establish a robust foundation for the future integration of our entire dual-core solution, highlighting the long-term value of our research.</p></dc:description>
<dc:publisher>IntechOpen</dc:publisher>
<dc:date>2026-03-11</dc:date>
<dc:type>Chapter, Part Of Book</dc:type>
<dc:identifier>https://www.intechopen.com/chapters/1237146</dc:identifier>
<dc:identifier>doi:10.5772/intechopen.1013084</dc:identifier>
<dc:language>en</dc:language>
<dc:relation>ISBN:978-1-80631-121-7</dc:relation>
<dc:rights>https://creativecommons.org/licenses/by/3.0/</dc:rights>
<dc:source>https://www.intechopen.com/books/1004966 ; Advances in Semiconductor Materials and Devices</dc:source>
</oai_dc:dc> |
| id | intech-1237146 |
| institution | IntechOpen |
| isbn | 978-1-80631-121-7 |
| language | English |
| last_indexed | 2026-10-15T21:41:34Z |
| publishDate | 2026 |
| publishDateRange | 2026 |
| publishDateSort | 2026 |
| publisher | IntechOpen |
| publisherStr | IntechOpen |
| record_format | oai_dc |
| spelling | intech-12371462026-03-11 Perspective Chapter: A Synergistic Strategy for Sub-10 nm IC Manufacturing – From Post-CMP Cleaning with Biomimetic PVA Smart Brushes to Post-EUV Encapsulation with Advanced Polyimide Ching-Cheng Huang Masashi Shiotsuki Toshio Masuda Physical Sciences, Engineering and Technology <p>This research introduces a novel synergistic strategy to fundamentally enhance the manufacturing yield and long-term reliability of sub-10 nm integrated circuits. Our approach deliberately bridges two distinct yet profoundly interconnected critical process nodes surrounding Extreme ultraviolet (EUV) lithography. First, we introduce a novel soft polymeric brush for post-chemical mechanical planarization (Post-CMP) cleaning. These materials feature a bio-inspired three-dimensional microchannel network, drawing inspiration from the pneumatic drainage systems of avian skeletons. This architecture, with its multi-scale channels, is engineered to enhance fluid flow and prevent particle entrapment, a leading cause of wafer scratching. We performed a comprehensive characterizationto verify their structural stability, purity, and safet, which establishes a new foundation for developing advanced cleaning materials that improve efficiency and protect delicate semiconductor structures. Subsequently, we introduce a advanced polyimide for post-EUV encapsulation as the second component of this strategy. Its unique transparency allows for critical non-destructive optical inspection of the ultra-fine sub-10 nm circuitry post-encapsulation, a capability vital for ensuring quality control and reliability. Acknowledging the significant challenges of a full-process-flow replacement, our practical process evaluation has led to a pragmatic phased implementation approach. We will first strategically focus on the bio-inspired polyvinyl acetal (PVA) brush technology. Its superior fluid exchange rate not only effectively reduces contamination, lowers defects, and improves yield, but it also dramatically conserves water. These advantages not only prove the efficacy of this single technology but also establish a robust foundation for the future integration of our entire dual-core solution, highlighting the long-term value of our research.</p> IntechOpen 2026-03-11 Chapter, Part Of Book https://www.intechopen.com/chapters/1237146 doi:10.5772/intechopen.1013084 en ISBN:978-1-80631-121-7 https://creativecommons.org/licenses/by/3.0/ https://www.intechopen.com/books/1004966 ; Advances in Semiconductor Materials and Devices |
| spellingShingle | Physical Sciences, Engineering and Technology Huang, Ching-Cheng Shiotsuki, Masashi Masuda, Toshio Perspective Chapter: A Synergistic Strategy for Sub-10 nm IC Manufacturing – From Post-CMP Cleaning with Biomimetic PVA Smart Brushes to Post-EUV Encapsulation with Advanced Polyimide |
| title | Perspective Chapter: A Synergistic Strategy for Sub-10 nm IC Manufacturing – From Post-CMP Cleaning with Biomimetic PVA Smart Brushes to Post-EUV Encapsulation with Advanced Polyimide |
| title_full | Perspective Chapter: A Synergistic Strategy for Sub-10 nm IC Manufacturing – From Post-CMP Cleaning with Biomimetic PVA Smart Brushes to Post-EUV Encapsulation with Advanced Polyimide |
| title_fullStr | Perspective Chapter: A Synergistic Strategy for Sub-10 nm IC Manufacturing – From Post-CMP Cleaning with Biomimetic PVA Smart Brushes to Post-EUV Encapsulation with Advanced Polyimide |
| title_full_unstemmed | Perspective Chapter: A Synergistic Strategy for Sub-10 nm IC Manufacturing – From Post-CMP Cleaning with Biomimetic PVA Smart Brushes to Post-EUV Encapsulation with Advanced Polyimide |
| title_short | Perspective Chapter: A Synergistic Strategy for Sub-10 nm IC Manufacturing – From Post-CMP Cleaning with Biomimetic PVA Smart Brushes to Post-EUV Encapsulation with Advanced Polyimide |
| title_sort | perspective chapter a synergistic strategy for sub 10 nm ic manufacturing from post cmp cleaning with biomimetic pva smart brushes to post euv encapsulation with advanced polyimide |
| topic | Physical Sciences, Engineering and Technology |
| url | https://www.intechopen.com/chapters/1237146 |
| work_keys_str_mv | AT huangchingcheng perspectivechapterasynergisticstrategyforsub10nmicmanufacturingfrompostcmpcleaningwithbiomimeticpvasmartbrushestoposteuvencapsulationwithadvancedpolyimide AT shiotsukimasashi perspectivechapterasynergisticstrategyforsub10nmicmanufacturingfrompostcmpcleaningwithbiomimeticpvasmartbrushestoposteuvencapsulationwithadvancedpolyimide AT masudatoshio perspectivechapterasynergisticstrategyforsub10nmicmanufacturingfrompostcmpcleaningwithbiomimeticpvasmartbrushestoposteuvencapsulationwithadvancedpolyimide |