Perspective Chapter: A Synergistic Strategy for Sub-10 nm IC Manufacturing – From Post-CMP Cleaning with Biomimetic PVA Smart Brushes to Post-EUV Encapsulation with Advanced Polyimide

<p>This research introduces a novel synergistic strategy to fundamentally enhance the manufacturing yield and long-term reliability of sub-10&thinsp;nm integrated circuits. Our approach deliberately bridges two distinct yet profoundly interconnected critical process nodes surrounding Extreme ultravi...

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Autores principales:	Huang, Ching-Cheng, Shiotsuki, Masashi, Masuda, Toshio
Formato:	Capítulo de libro
Lenguaje:	inglés
Publicado:	IntechOpen 2026
Materias:	Physical Sciences, Engineering and Technology
Acceso en línea:	https://www.intechopen.com/chapters/1237146
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